IROX - Multi Pie

Process

  • MULTI PIE
  • MULTI SAWING
  • SINGLE SIDE SAWING
  • DOUBLE SIDE SAWING
  • 1
    Single collate diamond setting.
  • 2
    Capable to cut highly complexed planned diamond like Multi Pie, Multi Sawing, Single Side & Double Side Sawing.
  • 3
    Consistent Results and Reliability.
  • 4
    Exceptional Beam Quality gives lowest breakages.
  • 5
    Polarization control allows to cut in any direction.
  • 6
    Sealed Resonator with Temperature and Humidity controller.
  • 7
    Best model in Performance with attractive & sleek design in industry.
  • 8
    Robust and sturdy structure for lowest vibration, minimum maintenance and high quality output.
  • 9
    Industry proven Components for long terms stability.
  • Laser
    : Lr
  • Spatial Mode
    : TEM00
  • Wavelength
    : 1064 nm
  • Polarization
    : Linear
  • Beam Roundness
    : >90%
  • Average Power
    : >16 W
  • Repetition Rate
    : 6-12 KHz
  • Cooling Water
    : Steam Distilled + 10% Optishield
  • Axis Travel
    : 130mm x 130mm x 70mm
  • Resolution
    : 2 Micron
  • Accuracy
    : 2 Micron / 25mm
  • Repeatability
    : 2 Micron / 25Micron Bidirection
  • Driver
    : AC Servo
  • Power Requirement
    : 220 VAC +10%,1 Phase,50 Hz
  • Power Consumption
    : <2.5 KVA
  • Room Temperature
    : 240 C - 260C
  • Length x Width x Height
    : 1200mm x 670mm x1500mm
  • Weight
    : 550Kg